The new high-end Dark Pro Series memory kits in the special “8Pack Edition” have been developed and tweaked with the help of overclocking icon Ian “8Pack” Parry and the renowned graphics card expert Andrew “Gibbo” Gibson. The dual- and quad-channel kits have been developed in cooperation with Team Group, Caseking and Links Ltd. in accordance with strict quality, performance and compatibility criteria.
The Features of the Team Group Dark Pro “8Pack Edition” RAM at a Glance:
Premium Samsung B-dies for maximum compatibility and stability
Low CAS latencies of 14-14-14-31 & up to 4500 MHz guaranteed memory clocks
Tested and compatible with the newest Intel Kaby Lake and AMD Ryzen platforms
High OC potential of over 4500 MHz or underclocking for CAS10 timings possible
Selected and produced according to the highest 8Pack performance and quality standards
Efficient aluminium heatspreader in a sandwich-style design
Incredible Overclocking Potential and Aggressive Timings
Samsung B-dies are used exclusively by the 8Pack Team due to their superb compatibility and overclocking potential, especially when paired with the latest Intel Kaby Lake (Z170/Z270) and AMD Ryzen platforms (B350/X370). The aggressive latencies out of the box of CAS 14-14-14-31 as well as their high overclocking potential mean that these kits have been designed from the ground up for enthusiast-level gaming and overclocking. Attainable frequencies extend to over 4000 MHz on the X299 platform and up to 3600 MHz on Ryzen systems with moderate latencies. But even in regards to latency tuning the Dark Pro “8Pack Edition” RAM kits are very flexible. This is what allows hassle-free CAS10 timings with lower memory clock frequencies.
Massive Heatspreader with Stylish Titanium-Grey Accents
The modules are equipped with massive black anodised aluminium heatspreaders in a sandwich-style design. This, in conjunction with the titanium-coloured centre and the notches, allows for a sleek and premium aesthetic design. The total height of the range is approximately 45,6 mm and should be kept in mind when choosing a CPU cooler. The heat dissipation capacity of the Dark Pro series is also especially high, meaning that they have plenty of cooling capacity spare during overclocking. Furthermore the PCB cover of the heatspreader can be removed, which reduces the total height to just 37 mm and markedly increases compatibility with larger CPU coolers.
Memory Type: DDR4
Capacity: 16 GB / 2x 8 GB (Dual-Channel)
Tested Frequency: DDR4-3200 MHz (PC4-25600)
Tested Latencies: CL 14-14-14-31
Tested Voltages: 1.20 – 1.40 V
Error Checking: Non-ECC
Type: 288-pin UDIMM
SPD Frequency: 2133 MHz
SPD Voltage: 1,2 V
CPU Compatibility: Intel Skylake/Skylake-X/Kaby Lake/Kaby Lake-X (LGA 1151 & LGA 2066) & AMD Ryzen 3, 5 & 7
Chipset Compatibility: Intel Z170, Intel Z270, AMD B350, AMD X370
Manufacturer’s Guarantee: Limited lifetime (10 years)