The innovation in the cooling of processors from High-End PC systems, notebooks and game consoles with a heat conduction pad!
The Coollaboratory Liquid MetalPad ist the first heat conduction pad, which is composed of 100% metal and melts with just less heating (BurnIn-process), then it confects its superior heat transfer. It dissipates the heat fast and efficiently and needn´t hide from the best heat conduction paste. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for HighEnd PCs and game consoles.
The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to exchange regular. The Coollaboratory Liquid MetalPad is certainly RoHS conformable and absolute nontoxic.
The Coollaboratory Liquid MetalPad is delivered in a transparent blister-package and contained depending on the variant one or several Liquid MetalPads. The Liquid MetalPads are available for CPU’s (ca. 38x38mm), GPU’s (ca. 20x20mm) and game consoles (ca. 42x42mm). Additionally there is a detailed printed manual included and according to the product variant a cleaning set for removal / cleaning of the contact area before and after using the Liquid MetalPad.